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System
- -Model : WSHF-6 Series (R&D)
- Wafer Size : 150mm(6")
- Type : Horizontal Furnace
- Compact design, Very small footprint
- Supported small size sample wafers
- STOS-H controller 
R&D Furnace (Auto loader)
Description
▶ Specifications
Description | Contents | Remark | |||||||||||||||||||||
Application Process | Wet Oxidation / N2, O2, Ar Annealing |
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Temperature Control Range | 200 ~ 1300℃ (Ramp up 20℃/min) |
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Temperature Control Zone | 3 zone |
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Temperature Accuracy | ±0.5℃ |
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Uniformity of film thickness | Wafer Within<2%, Wafer to Water<3%, Run To Run <3% |
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| Possible Process gases | N2, O2, Ar, H2O (MFC Control) | ||||||||||||||||||||||
| Wafer Size | 100mm, 150mm, 200mm | ||||||||||||||||||||||
Batch size | 25 / 50 Wafers |
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Auto Loader | Servo motor |
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Controller Type | PC-Base PLC control (OS : Windows 10) |
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| Dimension (W*D*H) | 800 *2300 *1500 | ||||||||||||||||||||||
| Power supply | 3 Phase 380V, 60A (system will be modified to country-specific power supply) | ||||||||||||||||||||||
| Cooling water | 10L/min | ||||||||||||||||||||||
| Compressed Dry Air | N/A | ||||||||||||||||||||||
| Heat Exhaust | 150 m3/h |
