Technology for Semiconductor & Disply Equipment Solution
Technology for Semiconductor & Disply Equipment Solution
300mm Vertical Furnace
▶ Specifications
Description | Contents | Remarks | |||||||||||||||||||||
Application Process | ■ Atmospheric Processes - Wet, Dry Oxidation - Thick Oxidation (15um) - Well Drive in - H2, N2 Annealing
■ LP-CVD Processes - Poly Si - D-Poly Si - Nitride : Si3N4 - Low stress Nitride (250MPa) - Super Low stress Nitride (Free ~ 50MPa) - Oxide - LTO, MTO, HTO, TEOS - Thick Oxide : TEOS (2um↑ ) - SiC CVD
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Operation Temperature | - 200℃ ~ 400℃ / Low Temp Process - 400℃ ~ 900℃ / LP-CVD Process - 900℃ ~ 1250℃ / High Temp Process |
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Temperature Control Zone | - 4 or 5 zone |
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Temperature Accuracy | - ±1℃ at 200℃ ~ 400℃ - ±0.5℃ at 500℃ ~ 1250℃ |
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Uniformity of film thickness | - Wafer within : <3% - Wafer to Wafer : <3% - Run to Run : <3% |
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Possible Process gases | - H2, Ar, O2, N2O, N2, SiH4, NH3, B2H6, PH3, SiH2Cl2, TEOS | ||||||||||||||||||||||
Wafer Size | - 300mm | ||||||||||||||||||||||
Batch size | - 50 ~ 100 Wafers |
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Boat Elevator | - 1 Axis Auto (Rotation Option) |
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Controller Type | - PLC Base PC Control (Windows 10 compatibility) |
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Dimension (W*D*H) | - 1700 * 1100 * 2800 (mm) / Capa. 50 wafers. - 1700 * 1100 * 3400 (mm) / Capa. 100 Wafers. | ||||||||||||||||||||||
Power supply | - 3 Phase 380V, 100A (system will be modified to country-specific power supply) | ||||||||||||||||||||||
Cooling water | - Max. 10 LPM | ||||||||||||||||||||||
Compressed Dry Air | - 500 ~ 1000 kPa | ||||||||||||||||||||||
Heat Exhaust | - 150 m3/h |