ModelWSHF-6 Series (R&D)
Wafer Size100mm(4") / 150mm(6") / 200mm(8")
TypeHorizontal Furnace
- Compact design, Very small footprint
- Supported small size sample wafers
- STOS-H controller
SpecificationsWSHF-6 Series (R&D)
Application Process |
Wet Oxidation / N2, O2, Ar Annealing |
Temperature Control Range |
200 ~ 1300℃ (Ramp up 20℃/min) |
Temperature Control Zone |
3 zone |
Temperature Accuracy |
±0.5℃ |
Uniformity of film thickness |
Wafer Within<2%, Wafer to Water<3%, Run To Run <3% |
| Possible Process gases | N2, O2, Ar, H2O (MFC Control) |
| Wafer Size | 100mm, 150mm, 200mm |
Batch size |
25 / 50 Wafers |
Auto Loader |
Servo motor |
Controller Type |
PC-Base PLC control (OS : Windows 10) |
| Dimension (W*D*H) | 800 *2300 *1500 |
| Power supply | 3 Phase 380V, 60A (system will be modified to country-specific power supply) |
| Cooling water | 10L/min |
| Compressed Dry Air | N/A |
| Heat Exhaust | 150 m3/h |