| Category | R&D Furnace |
|---|
ModelWRHF-6 Series (R&D)
Wafer Size150mm(6")
TypeHorizontal Furance
Compact design, Very small footprint
Supported small size sample wafers
STOS-H controller
Specifications
| Description | Contents |
|---|---|
Application Process |
N2,O2,Ar Annealing (Option vacuum pump) |
Temperature Control Range |
200 ~ 1400℃ (Temp. Ramp up 200℃/min) |
Temperature Control Zone |
3 zone |
Temperature Accuracy |
±0.5℃ |
Uniformity of film thickness |
Wafer Within<3%, Wafer to Water<3%, Run To Run <3% |
| Possible Process gases | N2, O2, Ar (MFC Control) |
| Wafer Size | 100mm, 150mm |
Batch size |
10 Wafers |
Auto Loader |
N/A |
Controller Type |
PC-Base PLC control (OS : Windows 10) |
| Dimension (W*D*H) | 900 *1700 *1480 |
| Power supply | 3 Phase 380V, 100A (system will be modified to country-specific power supply) |
| Cooling water | N/A |
| Compressed Dry Air | N/A |
| Heat Exhaust | 150 m3/h |