- STOS V3 controller
- Automatic boat elevator
- Low cost, high performance, Exceptional Thickness Uniformity
SpecificationsW-301M Series
Application Process |
Atmospheric Processes Wet, Dry Oxidation Thick Oxidation (15um) Well Drive in H2, N2 Annealing LP-CVD Processes Poly Si D-Poly Si Nitride : Si3N4 Low stress Nitride (250MPa) Ultra Low stress Nitride (0 ~ 50MPa) Oxide – LTO, MTO, HTO, TEOS Thick Oxide : TEOS (2um↑ ) SiC CVD |
Operation Temperature |
200℃ ~ 400℃ / Low Temp Process 400℃ ~ 900℃ / LP-CVD Process 900℃ ~ 1250℃ / High Temp Process |
Temperature Control Zone |
4 or 5 zone |
Temperature Accuracy |
±1℃ at 200℃ ~ 400℃ ±0.5℃ at 500℃ ~ 1250℃ |
Uniformity of film thickness |
Wafer within : <3% Wafer to Wafer : <3% Run to Run : <3% |
| Possible Process gases | H2, Ar, O2, N2O, N2, SiH4, NH3, B2H6, PH3, SiH2Cl2, TEOS |
| Wafer Size | 300mm |
Batch size |
50 ~ 100 Wafers |
Boat Elevator |
1 Axis Auto (Rotation Option) |
Controller Type |
PLC Base PC Control (Windows 10 compatibility) |
| Dimension (W*D*H) | 1700 * 1100 * 2800 (mm) / Capacity 50 wafers 1700 * 1100 * 3400 (mm) / Capacity 100 wafers |
| Power supply | 3 Phase 380V, 100A (system will be modified to country-specific power supply) |
| Cooling water | Max. 10 LPM |
| Compressed Dry Air | 500 KPa |
| Heat Exhaust | 150 m3/h |